NexCOBOT Taiwan
13F, No.916, Zhongzheng Rd., Zhonghe Dist., New Taipei City, Taiwan 23586, R.O.C.
TEL: +886-2-8226-7786


SMARC 2.1 Module with Intel Atom® x6000 Series Processors

  • Intel Atom® x6000 Series Processors
  • (SMARC™ Short Size)
  • Onboard eMMC 32GB
  • On board LPDDR4 memory non-ECC at 1866MHz,4GB/8G/16GB Skus.
  • Displays : DP++/ HDMI 1.4b / Dual channel LVDS
  • Onboard TPM2.0
  • 4 x PCIe x1 lanes.
  • 2 x GbE LAN, 2xUSB3.2
  • 2 x UCANART(RX/TX) , 1x HDA, 1xWDT, 1x TPM2.0
  • 2 x CAN FD , GPIO 4in /4out


SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals.

SMARC with Intel Atom® x6000 Processors ,Short Size Module dimension 82mm x 50mm, to support the next generation of IoT solutions , SMC260 comes with three processor variants with a TDP range of 6W to 12W, supports 2 x GbE LAN, 2 x USB3.2 Gen1 , 6 x USB2.0, 1 x SATA3.0 , 2 x UART(TX/RX), HD Audio, computing in applications spanning the retail, transport, industrial automation, and medical sectors.


  • Intel Atom® x6000 Series Processors
    Intel® Atom® x6425E Processor, Quad Core,EU32, 1.5M Cache, 2.0GHz (3.0GHz), 12W
    Intel® Atom® x6413E Processor, Quad Core,EU16 1.5M Cache, 1.5GHz (3.0GHz), 9W
    Intel® Atom® x6211E Processor, Dual Core,EU16 1.5M Cache, 1.3GHz (3.0GHz), 6W

Main Memory
  • On board LPDDR4 8GB or 16GB(Optional) SKUs
  • Default 8GB SKU

  • AMI (UEFI)

  • 1 x DP1.2++ (resolution up to 4096 x2160 @60Hz)
  • 1 x HDMI 1.4b (resolution up to 4096 x2160 @24Hz)
  • Dual Channel 18/24bit LVDS (1920x1080 @60Hz)

MXM 3.0 Golden Finger
  • 2 x USB 3.2 Gen1, 6 x USB2.0
  • 2 x COM, GPIO 4in/4out, HDA, TPM2.0 .
  • 1 x DP, 1 x HDMI1.4b, Dual channel LVDS, 4 x PCIe x1, 2 x SPI, 2 x I2C, 2 x SATA3.0 , 2 x GbE LAN , 2 x UART (TX/RX), 2 x CAN FD

Power Requirement
  • +12VDC, +5VSB 
  • Support both AT and ATX power supply mode

  • 82mm(L) x 50mm(W)

  • Board level operation temperature : -40°C to 85°C
  •  Storage temperature : -40˚C to 85˚C
  • Relative humidity:
    10% to 90% (operating, non-condensing)
    10% to 90% (non-operating, non-condensing)

  • Meet CE
  • FCC Class A

Ordering Information


SMC260X (P/N: TBD)
On board Intel Atom® Elkhart Lake x6425E, LPDDR4 8G, -40°C to 85°C

SMC260X-6413E (P/N: TBD )
 On board Intel Atom® Elkhart Lake x6413E, LPDDR4 8G, -40°C to 85°C

SMC260X-6211E (P/N: TBD )
 On board Intel Atom® Elkhart Lake x6211E, LPDDR4 8G, -40°C to 85°C

Optional Accessories
SMB-100 Carrier board (P/N:10E00010000X0)
Heat spreader Kit (P/N:TBD)
Heat Sink Kit (P/N:TBD)


上传日期 文件名 版本 OS 描述 下载